APECS: A European driving force for industrial innovation

With APECS – the pilot line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems – companies gain direct access to a Europe-wide, interconnected infrastructure for research, development and pilot manufacturing. For industrial users, this opens up new opportunities to bring complex systems to market more quickly. By closely linking research and application and providing access to cutting-edge microelectronics technologies, APECS supports industry, start-ups and SMEs in shortening innovation cycles, optimising costs and strengthening competitiveness in the long term.

From concept to application: advanced packaging and new chiplet approaches 

FMD will demonstrate how the potential of modern microelectronics can be translated into industrial applications through concrete use cases: A high-end performance packaging demonstrator from Fraunhofer IZM shows how different chips and functions can be integrated into a single system to enable high-performance electronics in a space-efficient and cost-effective way – a key factor for applications in automation, mobility, energy and artificial intelligence.

In addition, a technology example on quasi-monolithic integration (QMI) from Fraunhofer IPMS illustrates how modular chiplets are combined into an almost monolithic system. This allows different technologies to be integrated highly efficiently, minimizes signal loss, and enhances performance. Visitors will gain practical insights into current solutions for chip integration, thermal management and reliable, flexible and scalable system architectures.

G3C: Access to Europe’s semiconductor ecosystem

With the German Chips Competence Centre (G3C), also present at the booth, FMD specifically addresses the needs of those developing new products based on microelectronics or scaling existing technologies. As a central gateway, G3C connects the German semiconductor ecosystem with European design and manufacturing pilot lines, coordinates access and facilitates cross-border collaboration. In particular, SMEs and start-ups benefit from targeted support to implement innovation projects efficiently and accelerate their path to market. 

Insights on APECS and G3C

A presentation by G3C Project Manager Alexander Stanitzki on April 21 (11:40, Spotlight Stage, Hall 11, Booth B69) will provide insights into the practical implementation of Europe’s semiconductor strategy and its relevance for industry. In addition, FMD experts will be available throughout the event for individual discussions – from early-stage ideas to concrete collaboration opportunities.

Connect and unlock innovation potential now

FMD invites decision-makers from industry, SMEs and start-ups to visit Booth D33 (Fraunhofer joint stand, Hall 11) to explore concrete application and collaboration opportunities. Hannover Messe provides an ideal platform to jointly advance the next generation of high-performance, efficient and sustainable microelectronics.

About Research Fab Microelectronics Germany (FMD)

The Research Fab Microelectronics Germany (FMD) is a cooperation between 13 Fraunhofer Institutes and the two Leibniz institutes FBH and IHP. It serves as the central point of contact for all matters related to micro- and nanoelectronic research and development in Germany and across Europe. As a one-stop shop, FMD brings together advanced technologies and system solutions from its cooperating institutes to provide a customized, comprehensive portfolio. Established within FMD’s shared virtual framework in 2017, this joint research cooperation has grown into one of the largest of its kind, now comprising more than 5,400 employees and a uniquely broad range of expertise and infrastructure. Further information at www.forschungsfabrik-mikroelektronik.de/en.

Under the EU Chips Act, FMD is implementing APECS, a comprehensive pilot line to support resilient and trusted heterogeneous systems over the coming years. The APECS pilot line enhances the innovative capacity of European industries across various sectors and serve as a crucial foundation for Europe’s technological resilience. 

Alongside technological support, the »German Chips Competence Centre« (G3C), coordinated by the FMD, serves a strategic liaison role by representing the German semiconductor ecosystem at the European level, ensuring international visibility, and contributing national expertise to the European Network of Chips Competence Centres (ENCCC). 

Further information at www.forschungsfabrik-mikroelektronik.de/en