Chiplet technologies

Pilot line for »Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems« as part of the EU-Chips-Act.

Major advancement in applied research: The "Chiplet Application Hub" was launched at the Hannover Messe on March 31, 2025.

Andy Heinig, Head of the Chiplet Center of Excellence at the FMD Institute Fraunhofer IIS, on the first cluster in the newly founded Chiplet Application Hub.