Discover our Cleanroom Facilities

Cleanroom Facilities

FMD Cleanrooms in a nutshell

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More than 2.000 machines in 13 cleanrooms throughout Germany

More than 11.000 m2 cleanroom space

More than 10 million moves per year

Wafer-sizes from 2“ to 300 mm

Semiconductor materials from Si over SiGe to Compound Semiconductors like SiC, GaN, GaAs, InP and many more

Overview: Processing Capabilities within FMD

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Overview of the FMD Cleanrooms

Technological Highlights

7 Cleanrooms, partly with Automotive Certification,

200 mm BiCMOS/CMOS Lines, incl. FEOL and BEOL Module,

Special technologies like HV CMOS and high temperature CMOS (up to 300°C),

Interface to Foundry Companies,

300 mm Material, Process and Equipment screening Line,

200 mm / 300 mm Packaging Lines,

Automated Inline Process Monitoring,

Frontend and Backend Contamination Management and Control,

Single process developments and optimizations like Etching, ALD/ALE, Wet Cleaning, Annealing, Epitaxy (Si, SiGe), Implantation, CMP and many more.

Our know-how in detail

200 mm

Fraunhofer IISB, 200 mm Si Line

more than 1500 m2 cleanroom space - ISO 4 

Fraunhofer EMFT, ≤ 200 mm CMOS Line

ca. 1000 m2 cleanroom space - ISO 4

 

Fraunhofer IMS, 200 mm CMOS Line

more than 1500 m2 cleanroom space - ISO 4

Fraunhofer ISIT 200 mm Si Line

more than 1500 m2 cleanroom space - ISO 4 / 5

 

Leibniz IHP, 200 mm (Bi)CMOS Line

ca. 1000  m2 cleanroom space - ISO 1

Europractice IC Service

 

 

Fraunhofer IZM-Berlin 200 mm Packaging Line

more than 1500 m2 at both locations - ISO 6

 

300 mm

Fraunhofer IPMS 300 mm Screening FAB
ISO 6

Fraunhofer IZM-ASSID 300 mm Packaging Line
ca. 800 m2 cleanroom space - ISO 6

 

 

Technological Highlights

6 Cleanrooms with 200 mm MEMS-Lines and Foundry

Interface to Foundry Companies

Selected Processes on 300 mm Wafer diameter

200 / 300 mm Packaging Lines

Frontend and Backend Contamination Management and Control

Single Process Developments and Optimizations like Etching, ALD/ALE, Wet Cleaning, Piezo Materials and many more

Unser Know-how im Detail

200 mm

Fraunhofer ENAS ≤200 mm MEMS and sensor Line
ca. 1000 - 1500 m2 cleanroom space - ISO 4 / 6

Fraunhofer IMS 200 mm MEMS Line
ca. 1300 m2 cleanroom space - ISO 4

Fraunhofer IPMS 200 mm MEMS Line
more than 1500 m2 cleanroom space combined at 2 locations - ISO 4

Fraunhofer ISIT 200 mm MEMS Line
more than 1500 m2 cleanroom space - ISO 4 / 5

Fraunhofer IZM-Berlin 200 mm Packaging Line
more than 1500 m2 at both locations - ISO 6

 

Fraunhofer IZM-Berlin 200 mm Packaging Line

more than 1500 m2 at both locations - ISO 6

 

300 mm

Fraunhofer IZM-ASSID 300 mm Packaging Line

ca. 800 m2 cleanroom space - ISO 6

 

Technological Highlights

SiC-Prototype-Foundry: Production of Silicon Carbide-devices with wafer sizes from 100 mm to 150 mm at Fraunhofer IISB

InP Foundry: InP-Processing up to 4” at Fraunhofer HHI, and Leibniz FBH and InP-based Photonic-Integrated Circuits at Fraunhofer HHI

GaN-on Si 200 mm at Fraunhofer IAF & ISIT

III-V-Semiconductors: GaAs,  InxGa1-xAs,  InxGa1-xAsyP1-y,  InP,  GaN,  AlGaN,  AlN, AlScN, GaSb and more

Our know-how in detail

Up to 4" Compound Semiconductors

Leibniz FBH up to 100 mm Compound Semiconductors
ca. 2700 m2 cleanroom space - ISO 5 / 6

 

 

Fraunhofer HHI up to 100 mm Compound Semiconductors

ISO 4 / 6

Fraunhfoer IAF up to 100 mm Compound Semiconductors and WBG materials

ca. 1000 m2 cleanroom space - ISO 3 / 4

Up to 6" Compound Semiconductors

Fraunhofer IISB 150 mm SiC Line
more than 1500 m2 cleanroom space - ISO 4

 

 

Up to 8" Compound Semiconductors

Fraunhofer IAF (ISO 3 / 4) and ISIT (ISO 4 / 5) 200 mm GaN-on-Si Line (in Cooperation)

combined more than 2500 m² cleanroom space