Our cross-location competencies in Optoelectronic Systems

The technology platform »Optoelectronic Systems« focuses on the realization of optoelectronic devices and systems-on-chip. Applications include image acquisition and processing as well as communication up to Tbit/s-speed, Raman spectroscopy under strong scattered light conditions, and quantum optical sensors and measurement technologies for optical atomic clocks, for ground-based as well as space-based applications. From one single source, we offer the complete component and technology chain, e.g. for optical communication from emitter to modulator and receiver to fully integrated optoelectronic systems, including application-specific instruction-set processor based control and embedded software for these technologies.

Furthermore, the hybrid integration of active III-V-materials to polymer- and Si-based technology, incl. wafer level atomic layer deposition for encapsulation, plays a significant role in order to realize complete hybrid photonic integrated circuits (Hybrid PICs).


Realization of Optoelectronic Systems such as for communication up to Tbit/s-speed

Complete Signal Chain from emitter to modulator and receiver to fully integrated optoelectronic systems

Design of Single Devices, (integrated) Circuits or even Complete Systems, such as communication systems

In-depth knowledge in Processing a wide variety of Materials – from Si to compound semiconductors and polymers

Manufacturing of Passive Structures, like anti-reflection coatings and Laser; wide ranging Portfolio of different Laser Wavelengths: GaAs-based Laser (wavelength 905 nm), InP-based Laser (~ 1.5 µm) and III-V-semiconductor Laser with wavelengths in the range of 2-11 µm

Integration of III-V-Materials into Si-based Technology; heterogeneous integration: Advanced Packaging, Wafer Level Capping & Advanced Substrate/Interposer technologies

Characterization of the designed, manufactured and assembled optoelectronic systems and testing in multiple stress scenarios (thermal or mechanical stress); performing reliability and degradation assessments.

Flyer Optoelectronic Systems

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External Cavitiy Quantum Cascade Lasers

for completely new ways of infrared spectroscopy.


Tunable Laser Module

for a broad range of application fields.


Implementation / Coupling of a Photonic Integrated Circuit

from the cooperation in the BMBF project SPeeD


Laser Modules for Sprace Applications

Successfully used in space: a micro-integrated diode laser module

Packaging and Interconnection Technology for Optoelectronic Systems

With its 13 member institutes of the Fraunhofer-Gesellschaft and Leibniz Association, the Research Fab Microelectronics Germany (FMD) demonstrates research achievements of international excellence. In this way, FMD contributes to Germany and Europe, taking a leading position in research and development. Some selected research highlights and lighthouse projects in the field of packaging and interconnection technology for optoelectronic systems can be found below.

The list of all publications for the Optoelectronic Systems Technology Platform for download:

High-Precision Flip-Chip Bonding for Photonic Systems

© Fraunhofer IZM
FlipChip Bonder SET FC300: Accuracy of 1 µm at wafer level (factor 3 compared to the actual state) to achieve the hybrid integration of microelectronic, power electronic, photonic and sensor components on silicon wafers for further 3D integration.

The metallic micro-bumps are used to perform FlipChip assembly processes of the highest precision and the highest electrical connection density.

  • Demonstration of FlipChip Bonding in 3 µm pitch for optoelectronics (in cooperation with an international partner) with submicrometric postbond alignment
  • Demonstration of heterogeneous/hybrid silicon photonics Co-integration of InP-based and Si-based devices for highly packaged transceivers on silicon bench/submount in micrometric distance for photonic applications

EU project 5G-PHOS (H2020)

Papaioannou, S. et al. (2018):  5G mm Wave Networks Leveraging Enhanced Fiber-Wireless Convergence for High-Density Environments: The 5G-PHOS Approach, 2018 IEEE International Symposium on Broadband Multimedia Systems and Broadcasting (BMSB), Valencia, 2018, pp. 1-5. DOI: 10.1109/BMSB.2018.8436713

Flip-Chip Interface for the Hybrid Integration of InP Components for Silicon Photonics

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Am Beispiel des am Fraunhofer HHI installierten Pic&Place-Automaten für Hybridintegration von InP und Si- bzw. Polymerkomponenten möchten wir zeigen, wie die Investitionen vor Ort genutzt werden, um die technologischen Fähigkeiten der Institute auszubauen und so eine übergreifende Zusammenarbeit anzuregen. Weitere Informationen finden Sie im Video.

  • The world's first flip-chip integration of InP components into SiN-TriPleX photonic integrated circuits
  • New, patented InP components with high-precision contact surfaces for passive vertical adjustment
  • Development of an innovative process for active adjustment by means of spatially resolved reflectometry

BMBF-funded project PolyPhotonics Berlin
EU projekt UNIQORN (H2020)
EU projekt Teriphic (H2020)

Theurer, M. et al. (2020): Flip-Chip Integration of InP to SiN Photonic Integrated Circuits, JOURNAL OF LIGHTWAVE TECHNOLOGY, VOL. 38, NO. 9, MAY 2020, DOI: 10.1109/JLT.2020.2972065

Theurer, M. et al. (2019): Actively aligned flip-chip integration of InP to SiN utilizing optical backscatter reflectometry, Proc. ECOC, Dublin, Ireland, Sep. 2019, Paper W.2.B

Conradi H. et al. (2020): Hybrid integration of a polarization independent circulator, Proc. SPIE 11283, Integrated Optics: Devices, Materials, and Technologies XXIV, 112830J DOI: 10.1117/12.2545592

Kleinert, M. et al.(2019):  A platform approach towards hybrid photonic integration and assembly for communications, sensing, and quantum technologies based on a polymer waveguide technology, 2019 IEEE CPMT Symposium Japan (ICSJ), Kyoo (Japan), DOI: 10.1109/ICSJ47124.2019.8998655