One-Stop-Shop for the entire Micro- and Nanoelectronics Value Chain

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Aktionsprogramm 'Fraunhofer versus Corona'
© Fraunhofer

Microelectronics vs. Corona

Experts from the Research Fab Microelectronics Germany are helping to combat the COVID-19 pandemic. Here you can find an overview.

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Digital Events and Webinars

Join the webinars and online events of the FMD-institutes and learn more about their comprehensive expertise along the entire value chain; from R&D services to applications and new technologies.

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© Fraunhofer IISB
Chip-on-Chip Silver Direct Bonding: An innovative die-attach technique for 3D power integration. This technology allows micro-structured devices with thin metal films to be joined together without an intermediate layer. Normally, the direct bond is formed completely under solid-state conditions without liquid phase. In case of silver finish, direct bonds exhibiting high bonding strength and good interlayer electrical conduction can be already obtained at low temperature and pressure. Mehr Informationen finden Sie im Bereich Heterointegration.

FMD at the digital Sensor+Test 2021

Learn more about our wide-ranging competencies in sensor systems at our digital Sensor+Test 2021 short review.

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Benefit from the largest cross-site R&D Cooperation for Micro- and Nanoelectronics in Europe

Our Range of Applications

Discover our application examples in the following areas:

Our Range of Technologies

Learn more about our broad technology knowledge:

 

Sensor Systems

Sensor design, fabrication, integration, characterization, and testing within systems.

 

Extended CMOS

Design, fabrication and system integration of CMOS circuits.

 

Microwave & Terahertz

Cutting-edge devices and circuits for frequencies up to and including the THz range.

 

Power Electronics

Design and fabrication of power electronic devices, including integration in modules and systems.

 

MEMS Actuators

Design and fabrication, as well as characterization, testing and system integration of MEMS actuators.

 

Optoelectronic Systems

Fully integrated optoelectronic systems for image acquisition and processing, and communication up to Tbit/s speed.

From the FMD

Change in leadership FMD

Dr. Stephan Guttowski assumes leadership of the Research Fab Microelectronics Germany (FMD) starting 1 January 2021.

Infrastructure

Cleanroom Facilities

Discover our Germany-wide cleanroom facilites and technological highlights.

Application Example

LiDAR

The Research Fab Microelectronics Germany supports the (further) development of your LiDAR+ system!

Press releases and news from the FMD

In the press area of the FMD "Media Center" you will find current news from the Research Fab Microelectronics Germany.



For the modernization and extension of their equipment, the founding participants – eleven institutes of the Fraunhofer Group for Microelectronics as well as the Leibniz institutes FBH and IHP – receive around 350 million euros from the Federal Ministry of Education and Research.