Our cross-location competencies in MEMS Actuators

The technology platform MEMS Actuators focuses on design, materials and processes, system integration as well as characterization of materials, the test of devices and reliability assessments.

Design (analog and mixed signal design, designs for reliability, functional safety and harsh environments)

Material and Process Development for bulk and surface micromachining, including epitaxy, advanced Si Etch and piezoelectrical materials

Development of Devices like optical scanners, spatial light modulators (SLM) and acoustic actuators

Advanced Packaging and Silicon Micro Patterning and Methods of MEMS/NEMS Packaging e.g. hermetic glass packaging, wafer level capping can be offered as mature device technologies.

Test and Characterization of materials and devices (also in harsh environments); Nondestructive Analysis of Materials is widely possible in excellent quality; Device Degradation can be assessed, hetero-integrated systems can be characterized

Reliability Tests are feasible under multiple stress scenarios. Reliability Analysis under different loading is existing

MEMS Actuators along the value chain


Flyer MEMS Actuators


MEMS Micropump – TUDOS

Once a cancer tumor begins to metastasize, the chances of recovery diminish significantly. Fraunhofer EMFT tackled the challenge in the project μP Brain Test.


MEMS/CMOS Integration

In a well-established, highly productive cooperation, the Fraunhofer institutes IMS and IPMS are developing a process for integrating actuators on CMOS backplanes.