Our cross-location competencies in MEMS Actuators

The technology platform MEMS Actuators focuses on design, materials and processes, system integration as well as characterization of materials, the test of devices and reliability assessments.
 

Design (analog and mixed signal design, designs for reliability, functional safety and harsh environments)

Material and Process Development for bulk and surface micromachining, including epitaxy, advanced Si Etch and piezoelectrical materials

Development of Devices like optical scanners, spatial light modulators (SLM) and acoustic actuators

Advanced Packaging and Silicon Micro Patterning and Methods of MEMS/NEMS Packaging e.g. hermetic glass packaging, wafer level capping can be offered as mature device technologies.

Test and Characterization of materials and devices (also in harsh environments); Nondestructive Analysis of Materials is widely possible in excellent quality; Device Degradation can be assessed, hetero-integrated systems can be characterized

Reliability Tests are feasible under multiple stress scenarios. Reliability Analysis under different loading is existing

MEMS Actuators along the value chain

Flyer MEMS Actuators

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MEMS Micropump – TUDOS

Once a cancer tumor begins to metastasize, the chances of recovery diminish significantly. Fraunhofer EMFT tackled the challenge in the project μP Brain Test.

 

MEMS/CMOS Integration

In a well-established, highly productive cooperation, the Fraunhofer institutes IMS and IPMS are developing a process for integrating actuators on CMOS backplanes.

World Leader in Mirrors and Loudspeakers

With its 13 member institutes of the Fraunhofer-Gesellschaft and Leibniz Association, the Research Fab Microelectronics Germany (FMD) demonstrates research achievements of international excellence. In this way, FMD contributes to Germany and Europe, taking a leading position in research and development. Some selected research highlights and lighthouse projects in the field of MEMS actuators can be found below.

The list of all publications for the MEMS actuators technology platform for download:

Piezoelectrically Actuated Micromirrors

Built-up micro mirrors with piezoelectric AlN as transducer material.
© Fraunhofer ENAS
Built-up micro mirrors with piezoelectric AlN as transducer material.

World's first micro mirror with piezoelectric AlN as transducer material, which can realize a deflection angle of up to 25° (previous concepts create angles of 2-4°).

Cooperations:

  • AiF Project PI MEMS Control
  • SAB Junior Research Group E-PISA

Publications:

Meinel et.al. (2019): Piezoelectric Scanning Micromirror with Large Scan Angle Based on Thin Film Aluminum Nitride, 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), Germany, 2019, pp. 1518-1521. DOI: 10.1109/TRANSDUCERS.2019.8808723

Meinel et.al. (2020): Piezoelectric scanning micromirror with built-in sensors based on thin film aluminum nitride, IEEE Sensors Journal, early access. DOI: 10.1109/JSEN.2020.2997873

Meinel et.al. (2019): Piezoelectric scanning micromirror with built-in sensors based on thin film aluminum nitride, IEEE SENSORS, Canada, 2019, pp. 1-4. DOI: 10.1109/SENSORS43011.2019.8956929

Further information: 

Piezoelectric Micro Sensors based on aluminum nitride

Photonic Microsystems - MEMS-on-CMOS

Micro mirror array
© Fraunhofer IPMS
Micro mirror array
  • >>1 million individually controllable single mirrors with high integration density and pixel sizes down to 4 µm (worldwide unique)
  • Leading institute for the development of customer-specific, micro-mirror array-based surface light modulators (SLMs)
  • MEMS devices with analog/digital, tilt, and drop actuators or combined functionality
  • Surface micromechanics technology (MEMS-on-CMOS) with TiAl/USG as structural and sacrificial layers
  • Reduction of adhesive forces on MEMS contact surfaces implemented by the use of non-stick layers
  • Integrated CMOS drive circuit and external address electronics and data interface in continuous performance optimization
  • Goal: structural reduction through the use of DUV lithography and process control / metrology (e.g. coverage accuracy, OVL) for use in holography and other applications
  • Patented technology: US7424330, US 8531755, DE201510200626, DE102018215428

Cooperations:

EU-funded project SURPRISE (H2020)

Publications: 

Gehner, A. et al. (2020): Novel CMOS-integrated 512x320 tip-tilt micro mirror array and related technology platform, MOEMS and Miniaturized Systems XIX, Proc. of SPIE Vol. 11293, 1129302 (2020). DOI: 10.1117/12.2543052

Dürr, P. (2019): MEMS Piston Mirror Arrays with Force-Balanced Single Spring, MOEMS and Miniaturized Systems XVIII, Proc. SPIE 10931, 1093104 (2019). DOI: 10.1117/12.2507007

Further information: 

Smart Industrial Solutions

MEMS Loudspeakers for Mobile Applications

In-ear headphones with integrated MEMS speakers.
© Fraunhofer ISIT
In-ear headphones with integrated MEMS speakers.
  • The world's most powerful integrated MEMS loudspeaker technology
  • High playback quality, small size, and high efficiency
  • Drive via sputtered piezoelectric thin films

Cooperations: 

Publications:

Männchen, A. et. al. (2019): Design and electroacoustic analysis of a piezoelectric MEMS in-ear headphone, Audio Engineering Society Conference on Headphone Technology, 2019 USA. Abrufbar unter: http://publica.fraunhofer.de/documents/N-564755.html

Stoppel, F. et al. (2018): New integrated full-range MEMS speaker for in-ear applications, 2018 IEEE Micro Electro Mechanical Systems (MEMS), 2018, pp. 1068–1071. DOI: 10.1109/MEMSYS.2018.8346744

Stoppel, F. et al. (2017): Novel type of MEMS loudspeaker featuring membrane-less two-way sound generation, Audio Engineering Society, Convention Paper, 143rd Convention 2017 USA. Abrufbar unter: http://publica.fraunhofer.de/dokumente/N-518560.html

Further Information: 

Acoustic Systems and Micro Actuators