Green ICT @ FMD

• Know-how transfer in the creation of life cycle inventory models, life cycle assessments, and calculations of the carbon footprint of products and processes
• Consulting on more environmentally sustainable components and systems for sensor-edge-cloud applications and communication infrastructures
• More environmentally friendly manufacturing processes for microelectronic components through material substitution and energy savings in clean rooms
• Provision and plausibility checks for life cycle assessment data sets from the above-mentioned areas

Fäth GmbH

Innovation durch Slurry Recycling: Nachhaltigkeit in der Halbleiterindustrie – Dr. Matthias Schreyer.
Zum Video

MARPOSS Monitoring Solutions

Energieeffizienz durch KI: Nachhaltige Lösungen in der Zerspanung – Prof. Dirk Lange. 
Zum Video

• PE-Systems
  Contact person: Andreas Roßkopf (Fraunhofer IISB)
  Topic: Environmentally conscious optimization of a power electronics system
• Framatome
  Contact person: Niels Clausen (Fraunhofer ISIT)
  Topic: Energy Harvesting for Machine Monitoring
• Packwise
  Contact person: Volkhard Beyer (Fraunhofer IIS/EAS)
  Topic: Green Acid Monitoring and Tracking Solution (GAMATS)
• Adtran
  Contact person: Lutz Stobbe (Fraunhofer IZM)
  Topic: Determination of life cycle inventory data (Die areas) for life cycle assessments using the example of an optical transponder / SFP module
• Fritz!
  Contact person: Lutz Stobbe (Fraunhofer IZM)
  Topic: Development of concepts for resource-optimized electronics, applied to the example of the FRITZ! router.
• Nokia
  Contact person: Michael Peter (Fraunhofer HHI)
  Topic: Validation of the energy efficiency of various scheduling algorithms in a digital twin
• Adtran
  Contact person: Mihail Balanici (Fraunhofer HHI)
  Topic: Load-adaptive capacity adjustment for energy savings in optical networks
• Fäth, Infineon
  Contact person: Conrad Guhl (Fraunhofer IPMS)
  Topic: Evaluation of slurry recycling on an industry-equivalent 300 mm wafer platform
• Memsstar
  Contact person: Mohammad Hejjo Al Rifai (Fraunhofer ISIT)
  Topic: Optimization of energy consumption in plasma etching systems using energy monitoring systems and replacement of components
• SENTECH
  Contact person: David Sanchez (Fraunhofer IZM)
  Topic: Determination of the product carbon footprint (PCF) of a plant
• BOSCH
  Contact person: Sebastian Schulze (Leibniz-Institut für innovative Mikroelektronik IHP)
  Topic: Validation of an energy-optimized Al-Al wafer bonding process
• Würth
  Contact person: Chris Eckstein (Fraunhofer IZM)
  Topic: Identification of emission drivers from printed circuit boards
• Industriepartner mit Vertraulichkeitsvereinbarung
  Contact person: Josef Bernhard (Fraunhofer IIS)
  Topic: Sensor nodes for recording and wireless transmission of consumption values (water, electrical energy, or heat), design and life cycle assessment of an energy supply via energy harvesting
• Industriepartner mit Vertraulichkeitsvereinbarung
  Contact person: Rene Kirrbach (Fraunhofer IPMS)
  Topic: Improving the ecological balance of a self-sufficient sensor node through hardware adjustments and optimization of the Li-Fi data interface
• Industriepartner mit Vertraulichkeitsvereinbarung
  Contact person: Hung Quoc Nguyen (Fraunhofer EMFT)
  Topic: Evaluation of the F2/Ar/N2 gas mixture as an alternative to SF6 for chamber cleaning in selected PECVD plasma chambers in a production line

intelligent fluids GmbH

Goal: to evaluate water-based alternatives to the petroleum-based solvent processes currently used in the semiconductor industry.  Project

HyPhoX GmbH

Goal: to significantly reduce the carbon footprint in chip and system manufacturing as well as during the usage phase of digital rapid tests. Project

LIDROTEC GmbH

Goal: to reduce the ecological footprint by increasing energy and resource efficiency in the separation of electronic components for high-power applications. Project

DIVE imaging systems GmbH

Goal: to quantify the environmental savings in semiconductor manufacturing using hyperspectral vision technology. Project

XCCES GmbH

Goal: to research and test an innovative and comprehensive solution for cooling server systems in data centers. Project

muVaP Gmbh

Goal: to develop an application-specific integrated circuit (ASIC) for controlling piezoelectric actuators in microvalves and micropumps. Project

ÖKO-QUANT

Goal: to transparently quantify the environmental impact of a quantum-based testing device from QuantumDiamonds GmbH (QD) in semiconductor manufacturing. Project

Environmentally friendly and sustainable ICT

It stands to reason that the extremely dynamic and rapidly growing international ICT market must make its own significant and measurable contribution to achieving climate protection goals. However, this can only be achieved if, in addition to individual components, entire systems and their networking are considered and optimized throughout their entire life cycle. The “Green ICT @ FMD” competence center, launched in August 2022, focuses intensively on the following areas:

• Resource efficiency in sensor-edge-cloud systems
• Energy-saving communication infrastructures
• Resource-optimized electronics production

Feel free to contact us, we look forward to hearing from you!