Materials & Processes I Devices & Components

Integration of new material systems

MEMS-/ NEMS Sensors and Actuators and combinations with CMOS-Processes

High frequency compliant MEMS and SiGe-elements

Development of new devices in the BEoL-area

Device and system integration on 300 mm wafer

Compound semiconductors for leading-edge-devices and circuits for frequencies up to 800GHz

Power transistors based on Wide-Bandgap-Semcicondutors as well as optoelectronic devices

Further development of special substrates (e.g. SiC, AIN, Ga2O3)

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