The combined expertise of Fraunhofer HHI and IZM makes customer-specific miniaturized optoelectronic systems available for a broad range of application fields. The example board shown in the image comprises an integrated tunable laser chip based on Fraunhofer HHI’s photonic integration technology. The integrated tunable laser combines an InP-based active section, which allows 10 Gb/s direct modulation for data transmission, and a polymer-based passive section featuring a phase shifter and a tunable Bragg grating, which achieve a wavelength tunability of 20 nm in the C band. The integrated tunable laser was assembled on an electronic board designed and fabricated by Fraunhofer IZM. With novel technologies developed by Fraunhofer IZM, fabricating a robust 3D substrate, as well as integrating SMD and optoelectronic components, is achievable. The silica-filled epoxy resin board is manufactured using compression molding and is compatible with standard SMT processes, allowing it to be processed like a common PCB.