Fraunhofer Group for Microelectronics in cooperation with the Leibniz institutes IHP and FBH
Fraunhofer Group for Microelectronics in cooperation with the Leibniz institutes IHP and FBH

Examples for Worldwide Only Research Cooperation With Complete Production Chain for All Assembly Techniques of Power Modules

FuCera - Integrated SiC power module with integrated ceramic cooler

© Fraunhofer IISB
SiC power module with integrated ceramic heat sink
  • Maximum utilization of SiC semiconductor area due to Rth-optimized module and cooler design
  • High switching performance due to module integrated capacitor
  • Integrated cooling channel for maximum weight & power density

Cooperation:

Ceramtec GmbH

Further information:
www.iisb.fraunhofer.de/en/research_areas/packaging_reliability/packaging_for_electronics.html

http://insights.ceramtec-group.com/demonstrator

SiCmodul - SiC-based power electronics for fail-safe drive module technology

© Fraunhofer IZM
Fig. 1: Drive motor with axially integrated, 6-phase SiC drive inverter, Fig. 2: 6-phase SiC drive inverter, Fig. 3: Exploded view of the 6-phase SiC drive inverter, Fig. 4: One of 6 power modules of the SiC drive inverter soldered onto the PinFin heat sink
  • Ultra compact, highly functionally integrated power module design in PCB embedding technology for easy system integration and high temperature applications up to 175°C junction temperature
  • Highest switching speeds due to low commutation cell inductance of 1.7 nH
  • Integrated temperature and phase current sensors, driver and power supply
  • Integrated drive converter for unshielded, shortest motor cables
  • Common cooling circuit for motor and inverter

Cooperations:

BMBF supported project SiCModul

Publications:

  • Laumen M, et al. (2019): Rogowski-Coil-Based Current Sensor with Zero-Current Detection for Optimized Lower Cut-Off Frequency, in 21st European Conference on Power Electronics and Applications (EPE ’19 ECCE Europe), SEPTEMBER 2019. doi: 10.23919/EPE.2019.8915167.
  • Marczok C et al. (2020): SiCmodul - Modular high-temperature SiC power electronics for fail-safe power control in electrical drive engineering, in CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, March 2020. pp. 1-6. Print ISBN: 978-3-8007-5225-6.
  • Birkhold A, Martina M (2020): PCB embedding of SiC MOSFET for automotive power modules, in GMM-Fb. 94: EBL 2020 – Elektronische Baugruppen und Leiterplatten. FEBRUARY 2020. Print ISBN: 978-3-8007-5185-3.
  • Laumen M, et al. (2020): Ultra-Fast Short-Circuit Detection for SiC-MOSFETs Using DC-Link Voltage Monitoring, 2020 IEEE 11th International Symposium on Power Electronics for Distributed Generation Systems (PEDG), SEPTEMBER 2020. pp. 547-553. doi: 10.1109/PEDG48541.2020.9244367.

Further information:

www.izm.fraunhofer.de/de/institut/projekte/
sic-modul.html