Examples for Worldwide Only Research Cooperation With Complete Production Chain for All Assembly Techniques of Power Modules

FuCera - Integrated SiC power module with integrated ceramic cooler

© Fraunhofer IISB
SiC power module with integrated ceramic heat sink
  • Maximum utilization of SiC semiconductor area due to Rth-optimized module and cooler design
  • High switching performance due to module integrated capacitor
  • Integrated cooling channel for maximum weight & power density


Ceramtec GmbH

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SiCmodul - SiC-based power electronics for fail-safe drive module technology

© Fraunhofer IZM
Fig. 1: Drive motor with axially integrated, 6-phase SiC drive inverter, Fig. 2: 6-phase SiC drive inverter, Fig. 3: Exploded view of the 6-phase SiC drive inverter, Fig. 4: One of 6 power modules of the SiC drive inverter soldered onto the PinFin heat sink
  • Ultra compact, highly functionally integrated power module design in PCB embedding technology for easy system integration and high temperature applications up to 175°C junction temperature
  • Highest switching speeds due to low commutation cell inductance of 1.7 nH
  • Integrated temperature and phase current sensors, driver and power supply
  • Integrated drive converter for unshielded, shortest motor cables
  • Common cooling circuit for motor and inverter


BMBF supported project SiCModul


  • Laumen M, et al. (2019): Rogowski-Coil-Based Current Sensor with Zero-Current Detection for Optimized Lower Cut-Off Frequency, in 21st European Conference on Power Electronics and Applications (EPE ’19 ECCE Europe), SEPTEMBER 2019. doi: 10.23919/EPE.2019.8915167.
  • Marczok C et al. (2020): SiCmodul - Modular high-temperature SiC power electronics for fail-safe power control in electrical drive engineering, in CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, March 2020. pp. 1-6. Print ISBN: 978-3-8007-5225-6.
  • Birkhold A, Martina M (2020): PCB embedding of SiC MOSFET for automotive power modules, in GMM-Fb. 94: EBL 2020 – Elektronische Baugruppen und Leiterplatten. FEBRUARY 2020. Print ISBN: 978-3-8007-5185-3.
  • Laumen M, et al. (2020): Ultra-Fast Short-Circuit Detection for SiC-MOSFETs Using DC-Link Voltage Monitoring, 2020 IEEE 11th International Symposium on Power Electronics for Distributed Generation Systems (PEDG), SEPTEMBER 2020. pp. 547-553. doi: 10.1109/PEDG48541.2020.9244367.

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