GaN Chip Prepackage

© Fraunhofer IZM

Module with perfect switching even at highest switching speed, high reliability, lowest thermal resistance in combination with a low cost (plastic) cooler.

Module with perfect switching even at highest switching speed, high reliability, lowest thermal resistance in combination with a low cost (plastic) cooler.

Module eliminates packaging barriers:
a two layer ceramic substrate with a cooler structure on the bottom enables extremely low DC link inductance, EMI shielding, a short thermal path, good heat spreading and mechanical stiffness against cooling water pressure.

Combined with an innovative metalized transfer mold encapsulation it is possible to assemble local DC link components as SMD on top of the module as well as parts of the driver, which is required for fast switching and avoiding parasitic switch on.

 

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