Universal Sensor Platorm (USeP)

© Fraunhofer IIS/EAS

Example of a chip package

Universal Sensor Platform

Cooperation of industry (GLOBALFOUNDRIES Dresden Module One LLC & Co. KG) with FMD member institutes Fraunhofer IPMS, ENAS, IIS/EAS, IZM-ASSID

Goal: Development of a 22nm FDSOI based CMOS circuit, combined with a variety of sensors

Key aspects are competencies in the field of innovative packaging, system design, sensor development, data transfer, simulation and test


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