Topics
VR/AR/MR (Devices, Glasses and Head-up-Displays)
Voice/Emotion/Gesture Recognition & Command
Robotics & Interfaces (HMI, BCI)
Smart Textiles & Wearables
Tactile and haptic Sensors
Sensory Science, Odor Sensors
Software: Cloud & Cognitive Computing, AI Methodology
| Sensors: Tactile Sensors (MEMS or optical), Pressure Sensors (e.g. magneto-resistive, Ultrasonic); Bio Sensors (Glucose Mgt., Sweat / Gas Sensors); Odor Sensors | Audio & Voice Recognition: Hardware (MEMS loudspeakers, NED and piezo; microphones; Acoustic camera/3D Sound Camera) and software (e.g. Acoustic Analysis) |
| Comformable, Fexible, Stretchable Electronics: R2R, S2S, Fibre Optics (FBG-Sensors, Femtosecondlaser), Textile Integration (e.g. Textile 3D Integrated Shapes) | Object / Event recognition and distance measurement: Positioning Technologies and AI |
| VR/AR/MR: Inertial Sensors, ML for head motion classifaction, MEMS Micromirror arrays/Scanner, Beamforming/-training, VR Holodeck (Tracking/Localisation), Light field technology for real-life images | Video: Hardware (Holographs, Display Technology, multispectral camera, tunable micro lense, LiDAR/Spad Sensors for 3D Images/TOF, movement control and optical distance/runtime measurement, infrared sensors) and software (video compression, image processing, computer vision) |
| Robotics: Dextorous/autonomous in-hand manipulation, resistive sensor principle / miniaturized MEMS pressure sensors, artificial robotic skin, Spintronics for Spectral Noise Measurements, Hall Sensors for angle detection of robot arm; Multimodal distance and proximity measurement based on CMUTs, Training of robot hand to grasp using AI assisted by cameras |
Photonics (LED, Micro LED, LCD Microdisplays, Laser); Energy Harvesting Technologies and Wireless |
| Emotion/Gesture Recognition: Emotion Lab, Embedded AI (Neural Networks on microcontroller) | AI based intelligent signal processing (DSKI), AI for sensors (SNKI), Advanced Data Analytics; Hardware Architectures for AI (e.g. Neuromorphic hardware), Sensory Science using analytic modeling |
Fraunhofer-Verbund Mikroelektronik in Kooperation mit den Leibniz-Instituten FBH und IHP